Founded in 1995 in Buc – Versailles Grand Parc, France, 3D PLUS has quickly become a worldwide reference in the field of space microelectronic components. By combining advanced microelectronics design with 3D connectivity technology, enabling extreme miniaturisation, engineers have enabled customers to improve the performance and competitiveness of their systems, helping them to realise their dream space missions.
In collaboration with leading players in the global space industry, a series of firsts have been realised with 3D PLUS electronics modules designed and manufactured entirely in France:
The first 2 Gb Space NAND Flash memory for the Pluto New Horizon exploration mission in 2006 in collaboration with NASA/JPL.
Landing and photographing a comet with Philae/Rosetta in 2011 in collaboration with ESA and CNES.
Moon landing with Chinese Chang’E missions in 2018.
Landing of the Curiosity and Perseverance rovers on Mars in 2012 and 2021 in collaboration with NASA/JPL.
As a high-tech company, the development of 3D PLUS is based on unique expertise and patents that support a series of innovations in the fields of 3D electronic connectivity, miniaturisation technologies, thermal management and protection against the effects of space radiation.
42 years of Empa expertise comes together again with an industry giant! Don’t forget to contact us for 3D Plus solutions that produce high performance electronic components for military, aviation, space and defence sectors 😊.
